What caught your attention this week? (Intel3, foundries, ThrombUS+, VLEO)

THE Weekly electronic The team shares some notes – their picks of the week, in terms of announcements, developments, product releases, quotes or anything else that caught their attention in the wide world of electronics…

Caroline Hayes, editor
Chinese foundries are full; Taiwan capacity utilization at 70-80% – This could mean supply shortages and higher prices on the horizon.

David Manners, Component Editor
What caught my attention this week was that Intel announced that it was producing a high volume of Intel3 – the fourth process of its five-node project in four years.

Steve Bush, Technology Editor

Deep vein thrombosis can be fatal and initially remains “silent,” sometimes until it is too late. ThrombUS+ is a European project that aims to address this problem by using an easy-to-apply cuff to scan the legs of potential patients. The key to this scanning is an ultrasonic probe developed at Fraunhofer IPMS, which uses CMUTs (micro-machined capacitive ultrasonic transducers) to achieve sufficient resolution. AI will be used to differentiate thromboses from innocent blood and tissue, and the project includes generating appropriate training data.

Alun Williams, Web Editor

What caught my eye was that DARPA chose Redwire’s SabreSat VLEO (very low earth orbit) platform for its Otter propulsion research program.